Pin kisi susun
Pin grid array (PGA) atau pin kisi susun adalah jenis kemasan sirkuit terpadu teknologi lubang tembus (elektronik) dengan bentuk kotak bujur sangkar atau persegi panjang, dan pin-pinnya disusun dalam susunan teratur di bagian bawah paket. Pin biasanya diberi jarak 2,54 mm (0,1"), dan mungkin menutupi seluruh bagian bawah kemasan atau tidak.[1]
Array pin grid di bagian bawah prosesor AMD Phenom X4 9750 yang menggunakan soket AMD AM2+ PGA sering kali dipasang pada papan sirkuit tercetak menggunakan metode lubang tembus atau dimasukkan ke dalam soket. PGA memungkinkan lebih banyak pin per sirkuit terintegrasi dibandingkan paket lama, seperti paket dual in-line (DIP).
Lihat pula
- Sirkuit terpadu
- Kemasan elektronik
- Pengemasan sirkuit terpadu
- Papan sirkuit cetak
- Teknologi lubang tembus (elektronik)
- Daftar jenis kemasan sirkuit terpadu
- Soket CPU
Referensi
- ^ Vijay Nath (24 March 2017). Proceedings of the International Conference on Nano-electronics, Circuits & Communication Systems. Springer. hlm. 304. ISBN 978-981-10-2999-8.
- Thomas, Andrew (August 4, 2010). "What the Hell is… a flip-chip?". The Register. Diakses tanggal December 30, 2011.
- "XSERIES 335 XEON DP-2.4G 512 MB". CNET. October 26, 2002. Diakses tanggal December 30, 2011.
- "SURFACE MOUNT NOMENCLATURE AND PACKAGING" (PDF).
- Intel CPU Processor Identification
- Ball Grid Arrays: the High-Pincount Workhorses[pranala nonaktif permanen], John Baliga, associate editor, Semiconductor International, 9/1/1999
- Spot on component packaging[pranala nonaktif permanen], 08/1998, Elektronik, Produktion & Prüftechnik
- Terminology
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